기업의 가치를 창조하는 포엠일렉트로옵틱
Reactive Ion Etching | |
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Model | RIE |
Machine Dimension | W1470 L1000 H1800 |
Substrate size | 1~4" wafer |
Substrate batch | 1 wafer |
RF power | 600w, 13.56MHz |
Process gas or fluid | O2, He, CF4, SF6 |
Substrate motion | Manual |
System control | touch pc |
Base pressuse | ≤5.0E-7 torr |
RF Plasma Asher | |
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Model | MPB-612 |
Machine Dimension | W950 X L1190 X H1615 |
Substrate size | 1~6" wafer |
Substrate batch | 50 wafer / batch |
RF power | 1Kw, 13.56MHz |
Process gas or fluid | O2, N2 |
Process temp | Max 80~150(℃) |
Substrate motion | Auto load |
System control | Full auto, touch pc |
Base pressuse | ≤1.0E-2 torr |
RF Plasma Asher | |
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Model | A200 |
Machine Dimension | W870 L1100 H1900 |
Substrate size | 1~4" wafer |
Substrate batch | 1 wafer |
RF power | 600w, 13.56MHz |
Process gas or fluid | O2, N2 |
Substrate motion | Manual |
System control | touch pc |
Base pressuse | ≤5.0E-3 torr |
Laser Marker | |
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Nd:YVO4 Laser Marking System |
· UV Nd:YVO4 Laser · System Controller · Cutting controller & Software · 1,000W RF power & matching system |
Wafer Loading & Unloading System |
· 6" Wafer · Auto Loading & Unloading · Single Arm Vacuum Robot · LM & Timing Belt Syste, |
Wafer Flat Zone Aligner |
· Rotating & Sampling System · Mechanical Alignment Part |
Wafer Cassette Elevator System |
· 6" Wafer, 25 Slot Cassette 1EA loading · LM & Ball Screw System |
Frame | · Size : 920*1000*1564(H)mm |
Utility |
· Main Power : 220V 60Hz 50A · Air : 5~6kgf/cm2 |
SYSTEM | · PC controlled–PLC based system |
Wetstation | |
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Model | AWSE01 |
Machine Dimension | W2200 L1500 H1900 |
Substrate size | 6" wafer |
Substrate batch | 50 wafer |
Process gas or fluid | Acid |
Process temp | Max 100(℃) |
Substrate motion | Auto load (2 cassette) |
System control | Full auto, Touch panel |
Chemical bath | Quatz 4t, leak safety barrel, Heating system |
QDR rinse bath | Over flow type DI shower, N2 bubbling |
PECVD | |
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· Stand alone Dual chamber , Aluminum body chamber | |
· Load Lock Version with (2) two process modules | |
· PC controlled–windows based system | |
· Advanced Energy RFPP - RF5S power supply (500W – 13.56MHz) | |
· Advanced Energy AM5 matching network w/tuner | |
· Heated Chuck | |
· Watlow controller ~400도 | |
· 11” showerhead | |
· 8 gas MFC’s
- N2 : 5000 SCCM - CF4 : 500 SCCM - N2O : 1500 SCCM - O2 : 100 SCCM - N2 : 1000 SCCM - He/Ar : 3000 SCCM - NH3 : 20 SCCM - SiH4 : 350 SCCM |
|
· Can process up to 2” Wafer 4ea | |
· Throttle Valve & Gate Valve | |
· 1720 x 1050 x 1900 (mm) |
Halogen Illumination | |
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Model | HSP-250W |
Size | W125 X H328 X D130 mm |
Irradiation area | 60mm |
Illuminance | More than 400,000 lx |
Irradiation Distance | 220mm |
Light Source | Halogen lamp (Applying cold mirror) |
Lamp Type/Consumed power | ELC 500 24V 250W / AC220V 60Hz/DC 24V 350W |
Color Temp | 3400 °K |
Tone | White |
Environmental Temp | 0 ~ 40℃ |
Connection Pole size | 20 Φ |
Reformer Evaluation System | |
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Model | RES |
Machine Dimension | W1900 L1300 H2000 |
구성 | |
NG blower | |
DI water pump | |
Gas mixer | |
열교환기 | |
전화트랜스 | |
Heater | |
수소유량계 | |
워터트랩 | |
용량 5Kw |
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