기업의 가치를 창조하는 포엠일렉트로옵틱
| Reactive Ion Etching | |
|---|---|
| Model | RIE |
| Machine Dimension | W1470 L1000 H1800 |
| Substrate size | 1~4" wafer |
| Substrate batch | 1 wafer |
| RF power | 600w, 13.56MHz |
| Process gas or fluid | O2, He, CF4, SF6 |
| Substrate motion | Manual |
| System control | touch pc |
| Base pressuse | ≤5.0E-7 torr |
| RF Plasma Asher | |
|---|---|
| Model | MPB-612 |
| Machine Dimension | W950 X L1190 X H1615 |
| Substrate size | 1~6" wafer |
| Substrate batch | 50 wafer / batch |
| RF power | 1Kw, 13.56MHz |
| Process gas or fluid | O2, N2 |
| Process temp | Max 80~150(℃) |
| Substrate motion | Auto load |
| System control | Full auto, touch pc |
| Base pressuse | ≤1.0E-2 torr |
| RF Plasma Asher | |
|---|---|
| Model | A200 |
| Machine Dimension | W870 L1100 H1900 |
| Substrate size | 1~4" wafer |
| Substrate batch | 1 wafer |
| RF power | 600w, 13.56MHz |
| Process gas or fluid | O2, N2 |
| Substrate motion | Manual |
| System control | touch pc |
| Base pressuse | ≤5.0E-3 torr |
| Laser Marker | |
|---|---|
| Nd:YVO4 Laser Marking System |
· UV Nd:YVO4 Laser · System Controller · Cutting controller & Software · 1,000W RF power & matching system |
| Wafer Loading & Unloading System |
· 6" Wafer · Auto Loading & Unloading · Single Arm Vacuum Robot · LM & Timing Belt Syste, |
| Wafer Flat Zone Aligner |
· Rotating & Sampling System · Mechanical Alignment Part |
| Wafer Cassette Elevator System |
· 6" Wafer, 25 Slot Cassette 1EA loading · LM & Ball Screw System |
| Frame | · Size : 920*1000*1564(H)mm |
| Utility |
· Main Power : 220V 60Hz 50A · Air : 5~6kgf/cm2 |
| SYSTEM | · PC controlled–PLC based system |
| Wetstation | |
|---|---|
| Model | AWSE01 |
| Machine Dimension | W2200 L1500 H1900 |
| Substrate size | 6" wafer |
| Substrate batch | 50 wafer |
| Process gas or fluid | Acid |
| Process temp | Max 100(℃) |
| Substrate motion | Auto load (2 cassette) |
| System control | Full auto, Touch panel |
| Chemical bath | Quatz 4t, leak safety barrel, Heating system |
| QDR rinse bath | Over flow type DI shower, N2 bubbling |
| PECVD | |
|---|---|
| · Stand alone Dual chamber , Aluminum body chamber | |
| · Load Lock Version with (2) two process modules | |
| · PC controlled–windows based system | |
| · Advanced Energy RFPP - RF5S power supply (500W – 13.56MHz) | |
| · Advanced Energy AM5 matching network w/tuner | |
| · Heated Chuck | |
| · Watlow controller ~400도 | |
| · 11” showerhead | |
| · 8 gas MFC’s
- N2 : 5000 SCCM - CF4 : 500 SCCM - N2O : 1500 SCCM - O2 : 100 SCCM - N2 : 1000 SCCM - He/Ar : 3000 SCCM - NH3 : 20 SCCM - SiH4 : 350 SCCM |
|
| · Can process up to 2” Wafer 4ea | |
| · Throttle Valve & Gate Valve | |
| · 1720 x 1050 x 1900 (mm) | |
| Halogen Illumination | |
|---|---|
| Model | HSP-250W |
| Size | W125 X H328 X D130 mm |
| Irradiation area | 60mm |
| Illuminance | More than 400,000 lx |
| Irradiation Distance | 220mm |
| Light Source | Halogen lamp (Applying cold mirror) |
| Lamp Type/Consumed power | ELC 500 24V 250W / AC220V 60Hz/DC 24V 350W |
| Color Temp | 3400 °K |
| Tone | White |
| Environmental Temp | 0 ~ 40℃ |
| Connection Pole size | 20 Φ |
| Reformer Evaluation System | |
|---|---|
| Model | RES |
| Machine Dimension | W1900 L1300 H2000 |
| 구성 | |
| NG blower | |
| DI water pump | |
| Gas mixer | |
| 열교환기 | |
| 전화트랜스 | |
| Heater | |
| 수소유량계 | |
| 워터트랩 | |
| 용량 5Kw | |
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