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PRODUCT INTRODUCTION - R&D Machine PRODUCT INTRODUCTION - R&D Machine
PRODUCT INTRODUCTION - R&D Machine

R&D Machine introduction

Reactive Ion Etching
Model RIE
Machine Dimension W1470 L1000 H1800
Substrate size 1~4" wafer
Substrate batch 1 wafer
RF power 600w, 13.56MHz
Process gas or fluid O2, He, CF4, SF6
Substrate motion Manual
System control touch pc
Base pressuse ≤5.0E-7 torr
RF Plasma Asher
Model MPB-612
Machine Dimension W950 X L1190 X H1615
Substrate size 1~6" wafer
Substrate batch 50 wafer / batch
RF power 1Kw, 13.56MHz
Process gas or fluid O2, N2
Process temp Max 80~150(℃)
Substrate motion Auto load
System control Full auto, touch pc
Base pressuse ≤1.0E-2 torr
RF Plasma Asher
Model A200
Machine Dimension W870 L1100 H1900
Substrate size 1~4" wafer
Substrate batch 1 wafer
RF power 600w, 13.56MHz
Process gas or fluid O2, N2
Substrate motion Manual
System control touch pc
Base pressuse ≤5.0E-3 torr
Laser Marker
Nd:YVO4 Laser Marking System · UV Nd:YVO4 Laser
· System Controller
· Cutting controller & Software
· 1,000W RF power & matching system
Wafer Loading & Unloading System · 6" Wafer
· Auto Loading & Unloading
· Single Arm Vacuum Robot
· LM & Timing Belt Syste,
Wafer Flat Zone Aligner · Rotating & Sampling System
· Mechanical Alignment Part
Wafer Cassette Elevator System · 6" Wafer, 25 Slot Cassette 1EA loading
· LM & Ball Screw System
Frame · Size : 920*1000*1564(H)mm
Utility · Main Power : 220V 60Hz 50A
· Air : 5~6kgf/cm2
SYSTEM · PC controlled–PLC based system
Wetstation
Model AWSE01
Machine Dimension W2200 L1500 H1900
Substrate size 6" wafer
Substrate batch 50 wafer
Process gas or fluid Acid
Process temp Max 100(℃)
Substrate motion Auto load (2 cassette)
System control Full auto, Touch panel
Chemical bath Quatz 4t, leak safety barrel, Heating system
QDR rinse bath Over flow type DI shower, N2 bubbling
PECVD
· Stand alone Dual chamber , Aluminum body chamber
· Load Lock Version with (2) two process modules
· PC controlled–windows based system
· Advanced Energy RFPP - RF5S power supply (500W – 13.56MHz)
· Advanced Energy AM5 matching network w/tuner
· Heated Chuck
· Watlow controller ~400도
· 11” showerhead
· 8 gas MFC’s - N2 : 5000 SCCM
- CF4 : 500 SCCM
- N2O : 1500 SCCM
- O2 : 100 SCCM
- N2 : 1000 SCCM
- He/Ar : 3000 SCCM
- NH3 : 20 SCCM
- SiH4 : 350 SCCM
· Can process up to 2” Wafer 4ea
· Throttle Valve & Gate Valve
· 1720 x 1050 x 1900 (mm)
Halogen Illumination
Model HSP-250W
Size W125 X H328 X D130 mm
Irradiation area 60mm
Illuminance More than 400,000 lx
Irradiation Distance 220mm
Light Source Halogen lamp (Applying cold mirror)
Lamp Type/Consumed power ELC 500 24V 250W / AC220V 60Hz/DC 24V 350W
Color Temp 3400 °K
Tone White
Environmental Temp 0 ~ 40℃
Connection Pole size 20 Φ
Reformer Evaluation System
Model RES
Machine Dimension W1900 L1300 H2000
Composition
NG blower
DI water pump
Gas mixer
Heat exchanger
Phone trans
Heater
Hydrogen flow meter
Water trap
Capacity 5Kw
이용약관 개인정보처리방침 이메일무단수집거부
Address: Room 812, 120, Daehwa-ro, Daedeok-gu, Daejeon, Republic of Korea TEL : +82 42-933-4244~5
Fax : +82 42-933-4247 E-mail : 4meo@4meo.co.kr Business hours: Monday to Friday 09:00 ~ 18:00 (closed on Saturdays, Sundays and Holidays)

Copyright ⓒ 2014 4M Electro-Optics Co., Ltd. All rights reserved.

Copyright ⓒ 2014 4M Electro-Optics Co., Ltd. All rights reserved.